01CVD Diamond Application
Thermal Management
CVD Diamond Heat Spreaders & Thermal Substrates
— Material
Poly CVD Diamond, Mono CVD Diamond
— Specifications
- ◆Thermal Conductivity: 1200 / 1500 / 1800 / 2000 / 2200+ W/mK
- ◆Thickness: 0.2 – 2.5 mm
- ◆Flatness: <4 μm/cm
— Applications
- ◆High-power semiconductor devices
- ◆RF power modules
- ◆GaN on Diamond
- ◆Laser diode cooling
- ◆AI chip thermal management
- ◆Microwave electronics
- ◆Aerospace electronics
— Key Features
- ◆Ultra-high thermal conductivity
- ◆Electrical insulation
- ◆Low CTE
- ◆Excellent chemical stability
- ◆Metallization available
Need a custom thermal management solution?
Our engineering team supports laser cutting, double-side polishing, metallization, bonding and orientation cutting tailored to your process.
Talk to our team →— Other CVD Products
