— Product Line · HPHT

HPHT Diamond Powders

We specialize in the manufacturing of superior Agglomerated Diamonds and Diamond Balls, setting new benchmarks in the diamond industry with our exceptional quality — together with nano and micron Diamond Powder for precision lapping and slurry formulation.

Agglomerated Diamond
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Agglomerated Diamond

Our Agglomerated Diamonds are renowned for their extraordinary hardness and wear resistance, making them the ideal choice for applications demanding ultimate durability and precision.

  • Cluster morphology — higher cutting efficiency
  • Engineered grain shape for stable removal rate
  • Sub-micron to micron grades available
  • Excellent slurry suspension behavior
Diamond Ball
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Diamond Ball

Our Diamond Balls are the epitome of engineering excellence and craftsmanship, not only representing the pinnacle of precision but also standing out for their ultra-smooth surface finish. The high-sphericity morphology delivers a uniform rolling action and consistent contact behavior in advanced polishing and high-performance material applications.

  • High sphericity, ultra-smooth surface finish
  • Uniform particle morphology
  • Stable rolling action for precision polishing
  • Suited to high-performance material processes
Diamond Powder
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Diamond Powder

Navi Material's Diamond Powder is engineered with nano and micron grades for advanced industrial processes. Tight particle size distribution and consistent angular morphology enable use in slurries, suspensions, bonded tools and lapping films across the semiconductor, optics, ceramics and metallography industries. Available in two main families — Micron Diamond and Nano Diamond.

  • Two product families: Micron Diamond & Nano Diamond
  • Narrow particle size distribution
  • Used in slurries, suspensions and bonded tools
  • Customizable surface treatment
— Sub-categories under Diamond Powder
Micron Diamond

Micron Diamond

Precision micron HPHT diamond produced under tightly controlled synthesis with strict particle-size classification, delivering consistent shape, size and cutting behavior. Engineered for grinding, lapping and precision polishing of hard and brittle materials such as sapphire, SiC, ceramics and advanced composites.

  • Standard grades: 0.25 / 0.5 / 1 / 3 / 6 / 9 / 15 / 30 / 45 µm
  • Narrow D50 distribution, controlled D90
  • Stable cutting rate & low scratch profile
  • Applications: ceramics, sapphire, SiC, precision machining
Nano Diamond

Nano Diamond

Polycrystalline nano diamond particles and ready-to-use water- or oil-based polishing slurries (typical 4% concentration) for ultra-fine polishing, CMP and final finishing of semiconductor wafers, photonic substrates and high-end optics — delivering sub-nanometer Ra surface finish without subsurface damage.

  • Particle size: 5 – 250 nm
  • Slurry / suspension concentration: 1% / 4% / 10% (custom available)
  • Water-based and oil-based carriers
  • Applications: semiconductor, optics, advanced materials

HPHT Applications

Our HPHT line serves precision polishing across semiconductor wafers, optics, ceramics, advanced composites and metallographic sample preparation.