Thermal Management
CVD Diamond Heat Spreaders & Thermal Substrates
CVD Diamond Heat Spreaders and thermal substrates engineered to dissipate heat from the highest-power semiconductor devices. Available in polycrystalline and monocrystalline grades with thermal conductivity from 1200 W/mK up to 2200+ W/mK and metallization options for direct die attach.
- ▸Thermal Conductivity: 1200 / 1500 / 1800 / 2000 / 2200+ W/mK
- ▸Thickness: 0.2 – 2.5 mm
- ▸Flatness: <4 μm/cm
- ◆Ultra-high thermal conductivity
- ◆Electrical insulation
- ◆Low CTE
- ◆Excellent chemical stability
- ◆Metallization available

